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v pos = ? 65 v , r ds(on) = 120 m 4 series led bypass switc h es SPF5047 data sheet SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 1 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 description the SPF5047 is a bypass switch for the high - brightness matrix leds used in applications such as automotive headlights. the product includes four series switches to bypass individual leds, whose dimming systems are externally controlled by a c pu. each led h as open and short detection s th at can send fa ult flag s to the cpu . even if one of the four led s becomes open, the open - led is bypassed by its built - in power mosfet so that other leds can continue to work normally. the SPF5047 is supplied in a compact, surface - mount type hsop package, with an exposed pad for enhanced thermal dissipation. features 4 s earis led b ypass s witch es drives u p to 16 leds in s eries ( with 4 ics; at v f of an led is approx. 3 v ) low n oise : no charge - current - induced noise oc crus as each gate driver uses a negative power souce which requires no charge - pump circuit. high e f ficiency : optimized trade - offs between switching loss and switching noise allow highly - accurate control in tr and tf. fault flag reporting led open detection led short detection typical application pos com 1 vcc st ate 1 in 1 ropen com 2 com 3 neg st ate 3 in 3 st ate 4 in 4 iso cpu gnd test 10 1 12 8 6 14 20 15 21 17 23 19 13 18 st ate 2 in 2 16 22 24 4 package hsop 24 not to scale specification s v oltage a cross led capac ito s in series, v pos : ? 65 v (max.) bypass switch output current, i out : 2 a (max.) bypass switch on - resistance ( at 2 5 c ), r ds(on) : 120 m (typ.) applications automotive headlight daylight running lamp (drl) high - brightness matrix led system
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 2 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 contents description ------------------------------------------------------------------------------------------------------ 1 contents --------------------------------------------------------------------------------------------------------- 2 1. absolute maximum ratings ----------------------------------------------------------------------------- 3 2. electrostatic discharge (esd) -------------------------------------------------------------------------- 3 3. recommended operating conditions ----------------------------------------------------------------- 4 4. electrical characteristics -------------------------------------------------------------------------------- 4 5. block diagram --------------------------------------------------------------------------------------------- 6 6. pin configuration and definitions --------------------------------------------------------------------- 7 7. typical applications -------------------------------------------------------------------------------------- 8 8. physical dimensions ------------------------------------------------------------------------------------ 10 9. recommended land pattern -------------------------------------------------------------------------- 11 10. marking diagram --------------------------------------------------------------------------------------- 11 11. operational d escription ------------------------------------------------------------------------------- 12 11.1. overview -------------------------------------------------------------------------------------------- 12 11.2. turning on and off the ic ---------------------------------------------------------------------- 12 11. 3. switching operation ------------------------------------------------------------------------------ 12 11.4. led open/short detection ---------------------------------------------------------------------- 12 11.4.1. led short detection ------------------------------------------------------------------------ 13 11.4.2. led open detection ------------------------------------------------------------------------ 13 important notes ---------------------------------------------------------------------------------------------- 15
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 3 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 1. absolute maximum ratings current polar ities are defined as follows: current going into the ic (sinking) is positive current (+); and current coming out of the ic (sourcing) is negative current (?). unless specifically noted, t a = 25 c , g nd = ground . parameter sym bol test conditions rating unit remarks vcc?neg pin voltage v cn 70.5 v t < 10 s 72 v neg pin voltage v neg ? 65 to 0 v pos pin voltage v pos ? 65 to 0 v v cc pin voltage v cc 0 to 5.5 v input pin voltage v in 0 to 5.5 v state pin voltage v st 0 to 5.5 v state pin current i st 10 ma ropen pin voltage v ropen 0 to 5.5 v mosfet drain - to - source voltage v ds v clamp * v mosf et active clamp time t clamp 1 channel; i out = 2 a 100 ms 4 channels at once; i out = 2 a 50 ms output current i out 2 a junction temperature t j 150 c operating ambient temperature t opr ? 40 to 125 c power dissipation p d 6.2 w storage temperature t stg ? 40 to 150 c * limited by the active clamp v oltage, v clamp . 2. electrostatic discharge ( esd ) esd immunity test conditions: t a = 25 c , iso = ground. parameter symbol condit i ons min. ty p. max. unit human body model (hbm) v esd(hbm) c = 100 pf , r = 1.5 k * ? 2000 ? 2000 v ma chine model (mm) v esd(mm) c = 200 pf , r = 0 ? 200 ? 200 v * based on jeita eiaj ed - 4701 / 304 .
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 4 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 3. recommended operatin g conditions parameter symbol conditions min. typ. max. unit remarks logic supply voltage v cc 4.9 ? 5.1 v vcc pin pwm drive frequency f pwm 100 ? 500 hz in1 to in4 pins 4. electrical characteristics current polar ities are defined as follows: current going into the ic (sinking) is positive curr ent (+); and c urrent coming out of the ic (sourcing) is negative current (?). unless specifically noted, the characteristic values listed in this section are values per channel, and gnd is the ground. unless otherwise specified, the conditions are as follows: t j = ? 40 c to 1 25 c ; ( 1) the vcc pin v oltage, v cc = 5.0 v ; the neg pin v oltage, v neg = ? 30 v ; with the neg and iso pins being shorted. the v oltage ac ross the inx pin , which is placed in the channel not to be measured, should be fixed at 5 v. parameter symbol conditions min. typ. max. unit operation start voltage v cc(on) 3.0 3.5 4.0 v operation stop voltage v cc(off) 2.4 2.7 3.0 v circuit current 1 i cc1 v in 1 = v in 2 = v in 3 = v in 4 = 0 v ? ? 11 ma circuit current 2 i cc2 v in 1 = v in 2 = v in 3 = v in 4 = 5 v; drain -to - source voltage per mosfet = 4 v ? ? 11.5 ma in pin input thres hold voltage v thh 3.5 ? ? v v thl ? ? 1.5 v in pin input current i in ? 50 100 a output on - resistance r ds(on) t j = 25 c , i out = 1 a ? 120 150 m t j = 125 c , i out = 1 a ? ? 250 m active clamp voltage v clamp i out = 1 a ; inx in the non - measuring channe l = 0 v fixed 12 15 18 v short detection voltage ( 2) v sh v ropen = 2 v 1.25 1.5 1.75 v setting range for open detection threshold voltage (2) v o pr 1.75 ? 11 v open detection voltag e (2) v op2 v ropen = 0.5 v 1.84 2.00 2.16 v v op4 v ropen = 1 v 3.68 4.00 4.32 v v op8 v ropen = 2 v 7.36 8.00 8.64 v v op10 v ropen = 2.5 v 9.2 10.0 10.8 v ropen pin input current i rop v ropen = 3 v ? 1.2 4 a state p in output voltage v sth i state = ? 5 ma v cc ? 0.5 ? v cc v v stl i state = 5 ma 0 ? 0.5 v minimum open/short detection time t det 50 ? ? s (1) ? t j = ? 40 c ? is the parameter ensured by des ign only . for shipping inspection, all electrical charact eristics values shoul d be evaluated at t j = 25 c or 125 c . (2) refers to drain - to - source vol tage across each built - in mosfet .
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 5 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 parameter symbol conditions min. typ. max. unit internal oscillator clock cycle t clk 3.04 4 4.96 s short detection filter time t sh v ropen = 2 v 17.1 22.5 27.9 ms open detection filter time t op v ropen = 2 v 17.1 22.5 27.9 ms short detection recovery delay time t shb v ropen = 2 v ? ? 50 s open detection delay ti me t opr v ropen = 2 v ? ? 50 s open recovery filter t ime t opb v ropen = 2 v 12.4 16.4 20.4 ms filter time difference t op- opb t o p - opb = t op ? t op b 4.7 6.1 7.5 ms output propagation delay t on ( 3) ? 40 80 s t off ? 40 80 s output rise time tr 30 70 110 s output fall time tf 30 70 110 s output propagation delay difference t diff ? 30 ? 30 s junction - to - case thermal resistance j - c ? ? 4.9 c /w (3) drain - to - source voltage per mosfet = ? 30 v , with a 4 source resistor being connected. short the neg pin to the source pin in the channel to be measured. for switching characteristics definitions, see figure 4 - 1 below . inx v ds 0 . 9 v ds 0 . 1 v ds 0 . 1 v ds 0 . 9 t on t r t off t f drain - to - so u rce voltage v ds figure 4 - 1 . switchin g characteristics definition s t diff = t on ? t off
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 6 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 5. block diagram pos com 1 vcc st ate 1 in 1 ropen com 2 com 3 neg st ate 3 in 3 st ate 4 in 4 iso gnd test 10 1 12 8 6 14 20 15 21 17 23 19 18 st ate 2 in 2 16 22 24 13 short detection v cc gate drive voltage monitor 4 filter 2 ( timer 2 ) filter 1 ( timer 1 ) open detection v cc test uvlo osc
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 7 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 6. pin configuration and definitions 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 test state 1 state 2 state 3 state 4 ropen gnd in 1 in 2 in 3 in 4 vcc i so pos com 1 com 2 com 3 neg 25 fin pi n number pin name function 1 iso mic reference; internally shorted to neg 2 n . c . no connection 3 n . c . no connection 4 pos drain of channel 1 5 n . c . no connection 6 com1 source of channel 1, drain of channel 2 7 n . c . no connection 8 com2 source of c hannel 2, drain of channel 3 9 n . c . no connection 10 com3 source of channel 3, drain of channel 4 11 n . c . no connection 12 neg source of channel 4; internally shorted to iso 13 vcc 5 v power supply 14 in4 input for channel 4 15 in3 input for channel 3 16 in2 input for channel 2 17 in1 input for channel 1 18 gnd ground 19 ropen threshold voltage setting for led open detection; commonly applied to all channels (1 to 4) 20 state4 open/short detection for channel 4 21 state3 open/short detection fo r channel 3 22 state2 open/short detection for channel 2 23 state1 open/short detection for channel 1 24 test product inspection; normally left unused; must be shorted to gnd when used 25 fin backside heatsink; must be shorted to neg and iso when used
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 8 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 7. typical applications the neg pin, the iso pin, and the backside heatsink must be shorted on a pcb. connect these pins to the lowest potential (negative potential) among other pins. the test pin must be shorted to the gnd pin on a pcb. pos com 1 vcc st ate 1 in 1 ropen com 2 com 3 neg st ate 3 in 3 st ate 4 in 4 iso cpu gnd test 10 1 12 8 6 14 20 15 21 17 23 19 13 18 st ate 2 in 2 16 22 24 4 figure 7 - 1 . typical application (4 channel s )
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 9 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 pos com 1 vcc st ate 1 in 1 ropen com 2 com 3 neg st ate 3 in 3 st ate 4 in 4 iso cpu gnd test 10 1 12 8 6 14 20 15 21 17 23 19 13 18 st ate 2 in 2 16 22 24 4 pos com 1 vcc st ate 1 in 1 ropen com 2 com 3 neg st ate 3 in 3 st ate 4 in 4 iso cpu gnd test 10 1 12 8 6 14 20 15 21 17 23 19 13 18 st ate 2 in 2 16 22 24 4 figur e 7 - 2 . typical application (8 channel s )
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 10 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 8. ph y sical dimensions hsop 24 b Y ` ? ( r e n d ) notes: dimensions in millimeters pin treatment: pb - free (rohs c ompliant ) reflow (excludes gate protrusion) ( includes mold flash ) (ex cludes mold flash ) ( from backside to base o f lead ) enlarged view of a
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 11 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 9. recommended land pattern 10. marking diagram part number lot number : y is the last digit of the year of manufacture ( 0 to 9 ) m is the month of the year ( 1 to 9 , o , n , or d ) dd is the day of the month ( 01 to 31 ) x is the control number sk y m dd x s p f 5 0 4 7
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 12 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 11. operational description the characteristic values listed in this section are typical values, unless they are specified as minimum or maximum. current polarities are defin ed as follows: current going into the ic (sinking) is positive current (+); and current coming out of the ic (sourcing) is negative current (?). 11.1. overview t he SPF5047 is designed to provide dynamic dimming control for each of the four leds connected in s eries. the built - in mosfets connected in parallel to the leds alter the currents trhough these leds individually. with this array strategy, the leds used in the SPF5047 can be quickly turn ed off and be par tially dimmed even they are series - connected . mor eover, each led has open and short detections that can emit fault flag s . 11.2. turning on and off the ic the ic includes the uvlo (undervoltage lockout) circuit. w hen v cc(on) 3.5 v, the control ci rcuit in the ic is activated . the i c then drives the leds and sends pwm signals to all the in x pins (in1 to in4). when v cc(off) 2.7 v, the uvlo circuit starts it s operation to deactivate the control circuit. 11.3. switching operation a driving signal on the inx pin actuates the corresponding output mosfet. ( ? inx ? represents any one of the outputs.) the output mosfet then starts operating synchronously with the input si g nal on the inx pin. in a state where the inx pin is logic low (or ? l ? ) and the mosfet is on, an individual led turns off. the inx pin is also used to control led brightne ss. a pwm signal on the inx pin can enable pwm dimming, which changes the light intens ity of an led with a predetermined duty cycle. the frequency of pwm signals should range from 100 hz to 500 hz. the ic allows highly - accurate control in switching characteris tics, tr and tf, through optim ized trade - offs between switching loss and switchin g noise. consequently, the ic achieves high - efficient, low - noise switching operations. the control circuit is driven by a positive power source, whereas the mosfet driver is actuated by a negative power source in which the voltage between the pos and neg p ins is lower than the ground potential. in this method, the mosfet driver does not need any charge - pump circuit; therefore , charge - current - induced noise can be suppressed. 11.4. led open/short detection figure 11- 1 shows the internal bl ock diagram of channel 1 (ch1). the ic monitors the output mosfet drain - to - source voltage, v ds , to determine if an led open or short event has occurred. first, v ds is measured and then multiplied by 0.25, with an internal voltage monitor. then, the 0.25 ti mes voltage value is input to open and short detection comparators, respectively. each of the open and short detection comparators has a filter with the minimum open/short detection time, t det , of 50 s (min.). therefore, a signal shorter than t det cannot be detected as a fault flag. figure 11- 2 describes the relationship between input voltage across the open/short de tection comparator and drain - to - source voltage. when th e ic detects any malfunction, the statex pin is set to logic high (or ? h ? ) a nd transmits a fault flag to the microcontroller. ( ? statex ? represents any on e of the outputs.) the ic incorporates filter s to remove noise signals so that the microcontroller can properly respond to a low - to - high tr ansition on the statex pin inpu t signal. a clock cycle generated by t he built - in oscillator (osc) determines a filter time . pos com 1 st ate 1 in 1 ropen 17 23 19 short detection v cc gate drive voltage monitor 4 filter 2 ( timer 2 ) filter 1 ( timer 1 ) open detection v cc 6 drain - to - source voltage , v ds v sco v oco v oro v fo v cc figure 11- 1 . internal block diagram (ch1) drain - to - source voltage ( v ) input voltage across short / open detection comparator ( v ) 0 2 0 . 5 1 1 . 5 2 4 6 8 11 2 . 75 10 2 . 5 figure 11- 2 . input voltage across open/short detection comparator vs. drain - to - source voltage
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 13 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 11.4.1. led short detection figure 11- 3 shows the operating waveforms during an led sh ort event. and figure 11- 4 provides the enlarged view of a, illustrated in figure 11- 3 . if one or more leds are shorted to ground, the mosfet d rain - to - s ource vo ltage, v ds , attempts to decrease . the short detection voltage, v s h , is used for led status diagnostics and is set to 1.5 v . when a short condition (where v ds v sh ) persists for a period greater than the short detection filter time ( t sh ) of 22.5 ms , the statex pin in the shorted - led channel becomes logic high (or ? h ? ). w hen v ds exceeds v sh under th e short condition, the sh ort detection comparator waits to invert its output until t shb , the open detection recovery tim e of 50 s (max.) , has elapsed. following the output inversion of the short detection co mparator, the statex pin is put in to a logic low state (or ? l ? ) after 12 cycles of a clock pulse . then, the ic resumes its normal operation. v cc clock led driver power supply v cc ( on ) v ds v sh statex pin voltage t sh v sco a led shorted v cc ( off ) led shorted figur e 11- 3 . waveform s during short detection t shb v ds statex pin voltage v sco clock 12 cycles of clock pulse figure 11- 4 . waveforms during short detection (enlarged view of a) 11.4.2. led open detection figure 11- 5 shows the operating waveforms during an led open event. and figure 11- 6 provides the en l a rged view of b, illustrated in figure 11- 5 . if one or more leds are open, the m osfet d rain - to - s ource v oltage, v ds , attempts to increase . the open detection voltage, v op , is used to detect open - leds. when an open condition (where v ds v op ) persists for a period greater than the open detection filter time ( t op ) of 22.5 ms , the statex pin in the open - led channel becomes logic high (or ? h ? ) . even after the open detection comparator output, v oco , is held logic high, the microcontroller does not respond to an ? h ? signal whose duration is shorter than 3 cycle s of a clock pulse (see figure 11- 5 ). this is to prevent false detection s . when v ds falls below v op , the voltage on the open detection comparator, v oco , will be inverted after t opb , the open recovery filter time of 16.4 ms. following the output inversion of the open detection comparator, the short detection comparator is inverted after t shb of 50 s (max.). then, the statex pin is put into a logic low state (or ? l ? ) after 12 cycles of a clock pulse . this high - to - low transition mechanism is identical to that of the led short detection, as shown in figure 11- 4 . then, the ic resumes its normal operation. table 11- 1 indi cates how the v op values vary according to the ropen pin voltages. hence, n ote that the ropen pin voltages must be determined according to led currents.
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 14 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 table 11 - 1 . open detection voltage vs. ropen pin volt age symbol ropen pin voltage open detection voltage, v op m in. t yp. m ax. v op2 0.5 v 1.84 v 2.00 v 2.16 v v op4 1 v 3.68 v 4.00 v 4.32 v v op8 2 v 7.36 v 8.00 v 8.64 v v op10 2.5 v 9.2 v 10.0 v 10.8 v v cc clock v cc ( on ) v oco v ds v op statex pin voltage t op v sco t opb led driver power supply v fo b v oro led opened v cc ( off ) a figure 11- 5 . waveform s durin g open detection v ds v fo v oco clock t opr v sco v oro 3 cycles of clock pulse figure 11- 6 . waveforms during open detection (enlarged view of b)
SPF5047 SPF5047 - dse rev. 1.1 sanken e lectric c o .,l td . 15 sep. 0 7 , 2 01 6 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2016 important notes all data, illustrat ions, graphs , tables and any other information included in this document as to sanken? s products listed herein (the ? sanken products?) are current as of the date this document is issued . all contents in this document are subject to any change without notic e due to improvement of the sanken products , etc. please make sure to confirm with a sanken sales representative that the contents set forth in this document reflect the latest revisions before use. the sanken products are intended for use as components of electronic equipment or apparatus (transportation equipment and its control systems, home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). prior to use of the sanken products, please put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken. i f considering use of the sanken products for any applications that require higher reliability (traffic signal control systems or equipment, disaster/crime alar m systems, etc.), you must contact a sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken, prior to the use o f the sanken products. the sanken products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in class iii or a higher class as defined by relevant laws of japan (collectively, the ?specific applications?). sanken assumes no lia bility or responsibility whatsoever for any and all dam ages and losses that may be suffered by you, users or any third party, resulting from the use of the sanken products in the specific applications or in manner not in compliance with the instructions set forth he rein. in the event of using the sanken p roduc ts by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the same , you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. although sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the occurrence of any failure or defect in semiconductor products at a certain rate. you must take, at y our own responsibility , preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the sanken products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfunction of the sanken products. please refer to the relevant specification documents and sanken ? s official website in relation to derating. no a nti - radioactive ray design ha s been adopted for the sanken p roducts. no contents in this document can be transcribed or copied without sanken?s prior written consent. the c ircuit constant , operation examples, circuit examples, pattern layout examples, design examples , recommended exampl es , all information an d evaluation result s based thereon, etc., described in this document are presented for the sole purpose of reference of use of the sanken products and sanken assume s no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you, u sers or any third party , result ing from t he foregoing . all technical information described in this document (the ?technical information?) is presen ted for the sole purpose of reference of use of the sanken products and no license, express, implied or otherwise, is granted hereby under any intelle ctual property rights or any other rights of sanken. unless otherwise agreed in writing between sanken and you, sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performan ce of the sanken products (such as implied warranty of merchantability, or implied warranty of fitness for a particular purpose or special environment), (ii) that any sanken pro duct is delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course of dealing or usage of trade, and (iv) as to any information contained in this document (including its accuracy, usefulness, or reliability). in the event of using the sanken produ cts, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use of any particular controlled substances, including , but not limi ted to , the eu rohs directive , so as to be in strict compliance wit h such applicable laws and regulations . you must not use the sanken products or the technical information for the purpose of any military applications or use, including but not limited to the development of weapons of mass destruction. in the event of expo rting the sanken products or the technical information, or providing them for non - residents, you must comply with all applicable export control laws and regulations in each country including the u.s. export administration regulations (ear) and the foreign exchange and foreign trade act of japan , and follow the procedures required by such applicable laws and regulations. sanken assumes no responsibility for any troubles, which may occur during the transportation of the sanken products including the falling t hereof, out of sanken?s distribution network. although sanken has prepared this document with its due care to pursue the accuracy thereof, sanken does not warrant that it is error free and sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible error s or omissions in connection with the contents included herein . please refer to the relevant specification documents in relation to particular precautions when using the sanken products, and refer to our official website in relation to general instructions and directions for us ing the sanken products. all rights and title in and to any specific trademark or tradename belong to sanken or such original right holder(s). dsgn - aez - 1600 2

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